Mems Foundry offers MEMS foundry Services from single process steps in our MEMS foundry wafer fabrication to full turnkey mems product development from mems design concept through mems volume production, memss test and mems packaging.Mems manufacturing using Bipolar and CMOS Wafer Foundry, mems ASIC Design with SiCr, NiCr and TaN precision Thin Film Resistors - Research and Development Laboratories for semiconductor optoelectonics sensors microwave thin film active and passive components
Research and Development Laboratories for semiconductor optoelectonics sensors microwave thin film active and passive components
Mems Foundry provides process specialties bipolar wafer foundry, BICMOS wafer foundry, thin film vacuum deposition services, applied thin film processing for analog and mixed signal bipolar manufacturing processes, Analog CMOS wafer foundry, R&D support, research and development support for microelectronics and process specialties wafer Fab processing to customers from semiconductors and microelectronics industry. Bipolar wafer foundry includes the following processes: 20V bipolar process,45V bipolar process,75V bipolar process,25V super-beta bipolar process and high voltage dielectric isolated bipolar processes. R&D support is provided in the following fields of microelectronics: test and measurement, medical instrumentation, industrial process control and communications, thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), MEMS technology, smart sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications including SAW, Ti diffusion, light wave guides and Mach-Zender light modulators. Specialty wafer Fab processing: epi deposition, epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD nitride, PECVD nitride Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining with KOH anisotropic etch, backside sputter depositions of Ti/Ni/Ag, gold deposition, gold alloy, lift off processes, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by tri-metal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump, wafer probing, dicing services, wafer saw, package development, solid via packages, packaging and test services, failure analysis services, SEM, scanning electron microscopy, ellipsometer measurements, four point probe measurements.
CUSTOMER LOGIN TECHNICAL SUPPORT LIVE TECH SUPPORT REQUEST FOR QUOTE ORDER
Mems-Foundry CAPABILITIES BIPOLAR WAFER FOUNDRY VIRTUAL FAB: BUILD PROCESS RUN CARD ON LINE
DEVICE MODELING 5V BIPOLAR PROCESS SUBSTRATE MATERIALS LPCVD DEPOSITIONS
CIRCUIT SIMULATION 10V BIPOLAR PROCESS SUBSTRATE CLEANING PECVD DEPOSITIONS
LAYOUT DESIGN 20V BICMOS PROCESS EPITAXIAL DEPOSITION SPUTTER DEPOSITIONS
PROCESS SIMULATION 20V BIPOLAR PROCESS OXIDATION LIFT OFF PROCESS
MASKS MANUFACTURING 25V SUPER BETA PROCESS PHOTOLITHOGRAPHY BACKLAP / POLISH
WAFER FOUNDRY 25V BIPOLAR + JFET PROCESS WET ETCHING BACKSIDE METALLIZATION
Mems-Foundry WAFER PROBE TEST 25V BIPOLAR +DMOS PROCESS KOH ANISOTROPIC ETCH ANNEAL
LASER TRIM / MACHINING 45V BIPOLAR PROCESS MESA ETCH E-TEST
BACK GRIND / POLISHING 75V BIPOLAR PROCESS DRY ETCH WAFER PROBE
SEMICONDUCTORS BACKSIDE METALLIZATION 100V BIPOLAR PROCESS DOPING SOLDER BUMPING
WAFER FOUNDRY PACKAGING 150V BIPOLAR PROCESS ION IMPLANT DICING
APPLIED THIN FILMS FAILURE ANALYSIS 300V BIPOLAR PROCESS DIFFUSION DIE ATTACH
CONTRACT R&D SUPPORT LIFE TEST CLASS H 400V BIPOLAR PROCESS ANNEAL/DIFFUSION WIRE BONDING
SEM 500V BIPOLAR PROCESS SOG DEPOSITIONS PACKAGING MOLDING
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