Fundamental Physical constants -Universal constants per CODATA 1998 -National Institute of Standards and Technology of United States ;Semiconductor Devices-miscellaneous articles, abstracts, technical notes, letters, publications; Si, silicon physical constants, silicon optical, electrical, mechanical properties; Si3N4 color chart for LPCVD grown silicon nitride films; SiO2 color chart for thermally grown silicon dioxide films; Fundamental physical constants, universal physics constants; Fundamental Physical constants-Universal constants per CODATA 1998 -National Institute of Standards and Technology of United States ; Semiconductor Devices-miscellaneous articles, abstracts, technical notes, letters, publications; Si, silicon physical constants, silicon optical, electrical, mechanical properties; Si3N4 color chart for LPCVD grown silicon nitride films; SiO2 color chart for thermally grown silicon dioxide films; Fundamental physical constants, universal physics constants; MEMS Foundry provides process specialties bipolar wafer foundry, BICMOS wafer foundry, thin film vacuum deposition services, applied thin film processing for analog and mixed signal bipolar manufacturing processes, Analog CMOS wafer foundry, R&D support, research and development support for microelectronics and process specialties wafer Fab processing to customers from semiconductors and microelectronics industry. Bipolar wafer foundry includes the following processes: 20V bipolar process,45V bipolar process,75V bipolar process,25V super-beta bipolar process and high voltage dielectric isolated bipolar processes. R&D support is provided in the following fields of microelectronics: test and measurement, medical instrumentation, industrial process control and communications, thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), MEMS technology, smart sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications including SAW, Ti diffusion, light wave guides and Mach-Zender light modulators. Specialty wafer Fab processing: epi deposition, epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD nitride, PECVD nitride Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining with KOH anisotropic etch, backside sputter depositions of Ti/Ni/Ag, gold deposition, gold alloy, lift off processes, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by tri-metal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump, wafer probing, dicing services, wafer saw, package development, solid via packages, packaging and test services, failure analysis services, SEM, scanning electron microscopy, ellipsometer measurements, four point probe measurements. CUSTOMER LOGIN TECHNICAL SUPPORT LIVE TECH SUPPORT REQUEST FOR QUOTE ORDER MEMS FOUNDRY CAPABILITIES BIPOLAR WAFER FOUNDRY VIRTUAL FAB: BUILD PROCESS RUN CARD ON LINE DEVICE MODELING 5V BIPOLAR PROCESS SUBSTRATE MATERIALS LPCVD DEPOSITIONS CIRCUIT SIMULATION 10V BIPOLAR PROCESS SUBSTRATE CLEANING PECVD DEPOSITIONS LAYOUT DESIGN 20V BICMOS PROCESS EPITAXIAL DEPOSITION SPUTTER DEPOSITIONS PROCESS SIMULATION 20V BIPOLAR PROCESS OXIDATION LIFT OFF PROCESS MASKS MANUFACTURING 25V SUPER BETA PROCESS PHOTOLITHOGRAPHY BACKLAP / POLISH WAFER FOUNDRY 25V BIPOLAR + JFET PROCESS WET ETCHING BACKSIDE METALLIZATION MEMS Foundry WAFER PROBE TEST 25V BIPOLAR +DMOS PROCESS KOH ANISOTROPIC ETCH ANNEAL LASER TRIM / MACHINING 45V BIPOLAR PROCESS MESA ETCH E-TEST BACK GRIND / POLISHING 75V BIPOLAR PROCESS DRY ETCH WAFER PROBE SEMICONDUCTORS BACKSIDE METALLIZATION 100V BIPOLAR PROCESS DOPING SOLDER BUMPING WAFER FOUNDRY PACKAGING 150V BIPOLAR PROCESS ION IMPLANT DICING APPLIED THIN FILMS FAILURE ANALYSIS 300V BIPOLAR PROCESS DIFFUSION DIE ATTACH CONTRACT R&D SUPPORT LIFE TEST CLASS H 400V BIPOLAR PROCESS ANNEAL/DIFFUSION WIRE BONDING SEM 500V BIPOLAR PROCESS SOG DEPOSITIONS PACKAGING MOLDING silicon wafers, silicon, silicon slices, prime silicon wafers, test silicon wafers, particle monitor silicon wafers, furnace silicon wafers, mechanical silicon wafers, silicon wafer processing, silicon wafer services silicon wafers, silicon, silicon slices, prime silicon wafers, test silicon wafers, particle monitor silicon wafers, furnace silicon wafers, mechanical silicon wafers, silicon wafer processing, silicon wafer services, silicon wafers, silicon, silicon slices, prime silicon wafers, test silicon wafers, particle monitor silicon wafers, furnace silicon wafers, mechanical silicon wafers, silicon wafer processing, silicon wafer services,silicon wafers, silicon, silicon slices, prime silicon wafers, test silicon wafers, particle monitor silicon wafers, furnace silicon wafers, mechanical silicon wafers, silicon wafer processing, silicon wafer services, CRYSTALS, BaB2O4, BaF2, CaF2, LiF, MgF2, KBr, KCl, NaCl, CsI, CaCO3, KRS-5, KRS-6, KDP, KTP, PbMoO4, LiIO3, LiNbO3, Quartz, Sapphire, Scintillators, TeO2, TiO2, Rutile, ZnSe, Thermal Oxide, PSG/BPSG, Plasma Nitride, Polysilicon, Photolithography, Epitaxy, Metals, Photo Resist Coating, LPCVD Silicon Nitride, Plasma Oxide, TEOS Oxide, LTO Silicon Wafers, GaAs, Ge, InP, SOI, GaN, Fused Silica, Quartz Wafers, Fused Silica and Quartz Wafers, Ge, ultra-thin si wafer needs of fabs, equipment manufacturers, R&D houses, colleges and universities silicon wafers, silicon wafer, silicon, wafer, wafers, silicon, silicon wafer manufacturing, silicon wafer distributing, silicon wafer supply, silicon wafer vendor, silicon slices, test wafers, prime wafers, particle wafers, monitor wafers, particle monitor wafers, 100mm silicon wafers, 125mm silicon wafers, 150mm silicon wafers, 200mm silicon wafers, 300mm silicon wafers, 4 inch silicon wafers, 5 inch silicon wafers, 1 inch silicon wafers, 3 inch silicon wafers, 2 inch silicon wafers, silicon wafers, wafer processing, Gallium Arsenide, GaAs, Ga, Gallium, Arsenide, InP, GaN, Ge, Germanium, GaAs reclaim, wafer reclaim, silicon wafer processing, silicon processing, wafer services, silicon wafer services, epi wafers, passivation, wafers, oxide wafers, epitaxial wafers, si, Si, silicon test wafers, silicon prime wafers, silicon monitor wafers, silicon particle wafers, silicon mechanical wafers, silicon test slices, Virginia Semiconductor, Novotech, Telecom-STV
   
 
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HTE-AN100 Fundamental physical constants, universal physics constants
HTE-AN101 SiO2 color chart for thermally grown silicon dioxide films
HTE-AN102 Si3N4 color chart for LPCVD grown silicon nitride films
HTE-AN103 Si, silicon physical constants, silicon optical, electrical, mechanical properties
HTE-AN104  
HTE-AN105  
HTE-AN106  
HTE-AN107  
HTE-AN108  
HTE-AN109  
HTE-AN110  
HTE-AN111 Semiconductor Devices-miscellaneous articles, abstracts, technical notes, letters, publications
   
 
 
 

  Fundamental Physical constants-Universal constants per CODATA 1998 -National Institute of Standards and Technology of United States
   
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